MAX812LEUS-T

Product Summary

The MAX812LEUS-T is a low-power microprocessor (μP) supervisory circuit device that performs a single function. It asserts a reset signal whenever the VCC supply voltage falls below a preset threshold. And the MAX812LEUS-T also provides a debounced manual reset input. Low supply current makes the MAX812LEUS-T ideal for use in portable equipment. This device comes in a 4-pin SOT143 package.

Parametrics

MAX812LEUS-T absolute maximum ratings: (1)Terminal Voltage (with respect to GND) VCC: -0.3 V to 6.0 V; (2)Terminal Voltage (with respect to GND) All Other Inputs: -0.3 V to (VCC + 0.3 V); (3)Input Current, VCC, MR: 20 mA; (4)Output Current, RESET or RESET: 20 mA; (5)Operating Temperature Range: -40 to +85℃; (6)Storage Temperature Range: -65℃ to +160℃; (7)Lead Temperature (soldering, 10sec): +300℃; (8)Continuous Power Dissipation (TA = +70℃) 4-Lead SOT143: 320 mW.

Features

MAX812LEUS-T features:(1)Package Type: 4-Lead SOT143; (2)Lead Frame: Copper; (3)Lead Finish: Solder Plate; (4)Die Attach: Silver-filled Epoxy; (5)Bondwire: Gold (1.0 mil dia.); (6)Mold Material: Epoxy with silica filler; (7)Assembly Diagram: Buildsheet 05-1701-0263; (8)Flammability Rating: Class UL94-V0; (9)Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1; (10)Dimensions: 37 x 31 mils; (11)Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)Interconnect: Aluminum/ Copper/ Si; (12)Backside Metallization: None; (13)Minimum Metal Width: 1.2 microns (as drawn); (14)Minimum Metal Spacing: 1.2 microns (as drawn); (15)Bondpad Dimensions: 5 mil. Sq.; (16)Isolation Dielectric: SiO2; (17)Die Separation Method: Wafer Saw; (18)Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl (Executive Director of QA); (19)Kenneth Huening (Vice President); (20)Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet; (21)0.1% For all Visual Defects; (22)Observed Outgoing Defect Rate: < 50 ppm; (23)Sampling Plan: Mil-Std-105D.

Diagrams